| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 05 | WO/2025/152452 | CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD FOR CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | CN2024/116123 | H01L 23/31 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020608 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | CN2024/126204 | H01L 27/02 | BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020668 | SMALL-SIZED OXIDE SEMICONDUCTOR ETCHING METHOD | CN2024/135579 | H01L 21/467 | BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020797 | INTERFACE LEAD-OUT METHOD FOR FLIP-CHIP STACKED TRANSISTOR, TRANSISTOR, COMPONENT, AND DEVICE | CN2025/077596 | H01L 21/768 | PEKING UNIVERSITY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020831 | ESD PROTECTION DEVICE AND CHIP | CN2025/080979 | H01L 23/60 | CSMC TECHNOLOGIES FAB2 CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020851 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | CN2025/083328 | H01L 21/48 | SHANGHAI WANSHENG ALLOY MATERIALS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021004 | CHIP HEAT DISSIPATION STRUCTURE AND PACKAGING METHOD | CN2025/099193 | H01L 21/56 | NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021027 | SUBSTRATE HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD AND COATING AND DEVELOPING DEVICE | CN2025/100146 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021031 | PROCESS TUBE AND FURNACE TUBE APPARATUS | CN2025/100208 | H01L 21/67 | ACM RESEARCH (SHANGHAI) , INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021171 | PACKAGING STRUCTURE AND ELECTRONIC DEVICE | CN2025/105132 | H01L 23/552 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021266 | METHOD FOR MEASURING TEMPERATURE OF WAFER IN REACTION CHAMBER, AND REACTION CHAMBER | CN2025/107621 | H01L 21/67 | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021982 | SEMICONDUCTOR STRUCTURE | EP2025/070428 | H01L 23/48 | AMS-OSRAM AG | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022021 | COMPOSITION, ITS USE AND A PROCESS FOR SELECTIVELY ETCHING SILICON-GERMANIUM LAYERS | EP2025/070634 | H01L 21/306 | BASF SE | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022293 | LIGHT-EMITTING MODULE AND MOTOR VEHICLE | EP2025/071330 | H01L 25/075 | VALEO VISION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022895 | DISPLAY DEVICE | JP2024/026154 | H01L 29/786 | SHARP DISPLAY TECHNOLOGY CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022899 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, HEAT-RESISTANT MEMBER, AND SEALING MATERIAL | JP2024/026170 | H01L 21/683 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022919 | COOLING DEVICE | JP2024/026228 | H01L 23/36 | NISSAN MOTOR CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022936 | SEMICONDUCTOR MODULE | JP2024/026329 | H01L 23/12 | NISSAN MOTOR CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022963 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, AND APPARATUS FOR MANUFACTURING SILICON CARBIDE SUBSTRATE | JP2024/026416 | H01L 21/268 | ITES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022990 | ELECTRIC POWER CONVERSION APPARATUS | JP2024/026535 | H01L 23/40 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022991 | DIAGNOSTIC DEVICE, DIAGNOSTIC METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM | JP2024/026538 | H01L 21/683 | HITACHI HIGH-TECH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023006 | SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM | JP2024/026576 | H01L 21/205 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023028 | DIAGNOSTIC APPARATUS, DIAGNOSTIC SYSTEM, AND DIAGNOSTIC METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS | JP2024/026661 | H01L 21/02 | HITACHI HIGH-TECH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023056 | SEMICONDUCTOR THIN FILM STRUCTURE | JP2024/026808 | H01L 21/20 | NTT, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023075 | METHOD FOR ACQUIRING CORRECTION VALUE, METHOD FOR CONTROLLING TEMPERATURE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND PROGRAM | JP2024/026870 | H01L 21/324 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023121 | SEMICONDUCTOR DEVICE | JP2025/002815 | H01L 25/07 | KABUSHIKI KAISHA TOSHIBA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023135 | SEMICONDUCTOR DEVICE | JP2025/007115 | H01L 23/473 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023159 | SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE, AND PROGRAM | JP2025/012863 | H01L 21/31 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023163 | SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND PROGRAM | JP2025/013204 | H01L 21/268 | KOKUSAI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023169 | ROBOT SYSTEM | JP2025/014456 | H01L 21/677 | KAWASAKI JUKOGYO KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023172 | LIGHTING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR DEVICE INSPECTION DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE INSPECTION METHOD | JP2025/014865 | H01L 21/52 | FASFORD TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023176 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | JP2025/015213 | H01L 21/306 | SCREEN HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023227 | HEAT TREATMENT DEVICE AND HEAT TREATMENT METHOD | JP2025/018794 | H01L 21/324 | SCREEN HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023247 | STACKED STRUCTURE AND SEMICONDUCTOR DEVICE | JP2025/019857 | H01L 21/20 | JAPAN DISPLAY INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023257 | DIAGNOSTIC DEVICE, MOUNTING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2025/020562 | H01L 21/52 | FASFORD TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023361 | SEMICONDUCTOR MANUFACTURING DEVICE | JP2025/023842 | H01L 21/683 | TEIKOKU TAPING SYSTEM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023419 | STAGE AND SUBSTRATE PROCESSING DEVICE | JP2025/024710 | H01L 21/683 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023420 | STAGE, SUBSTRATE PROCESSING DEVICE, AND TEMPERATURE ADJUSTMENT METHOD | JP2025/024712 | H01L 21/683 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023428 | PRODUCTION METHOD FOR DEVICE CONNECTED BODY, AND DEVICE CONNECTED BODY | JP2025/024766 | H01L 23/14 | TOYOBO CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023458 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | JP2025/025085 | H01L 23/40 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023470 | ROBOT SYSTEM AND CONTROL METHOD FOR ROBOT SYSTEM | JP2025/025187 | H01L 21/677 | KAWASAKI JUKOGYO KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023472 | PROCESSING SYSTEM, REMOVAL JIG, AND REMOVAL METHOD | JP2025/025201 | H01L 21/677 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023473 | BONDING DEVICE AND BONDING METHOD | JP2025/025206 | H01L 21/02 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023476 | INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING DEVICE | JP2025/025234 | H01L 21/02 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023488 | ALIGNER, ROBOT SYSTEM, AND SUBSTRATE ALIGNMENT METHOD | JP2025/025270 | H01L 21/68 | KAWASAKI JUKOGYO KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023489 | SEMICONDUCTOR COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPOSITE SUBSTRATE | JP2025/025275 | H01L 21/20 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023498 | SYSTEM FOR TEACHING SUBSTRATE TRANSFER ROBOT AND METHOD FOR TEACHING SUBSTRATE TRANSFER ROBOT | JP2025/025330 | H01L 21/677 | KAWASAKI JUKOGYO KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023521 | IMPRINT MOLD SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND IMPRINT MOLD AND METHOD FOR MANUFACTURING SAME | JP2025/025464 | H01L 21/027 | DAI NIPPON PRINTING CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023536 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ASSEMBLY | JP2025/025577 | H01L 23/29 | ROHM CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023540 | MAPPING DEVICE AND MAPPING METHOD | JP2025/025592 | H01L 21/67 | SINFONIA TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023566 | METHOD FOR MANUFACTURING CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE | JP2025/025727 | H01L 23/12 | AJINOMOTO CO., INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023666 | CERAMIC COPPER CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD | JP2025/026263 | H01L 23/13 | NITERRA MATERIALS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023830 | TRANSIENT LIQUID PHASE DIFFUSION BONDING PREFORM INCLUDING UNIDIRECTIONAL POROUS METAL BODY, AND TRANSIENT LIQUID PHASE DIFFUSION BONDING METHOD AND POWER MODULE USING SAME | KR2025/007270 | H01L 23/373 | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023840 | SUBSTRATE PROCESSING DEVICE AND OPERATION METHOD THEREOF | KR2025/007410 | H01L 21/67 | PSK HOLDINGS INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023911 | METHOD FOR DIVIDING PROCESSING TARGET | KR2025/009358 | H01L 21/78 | EO TECHNICS CO.,LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023992 | ACTIVE HEAT DISSIPATION MODULE | KR2025/010521 | H01L 23/38 | NAINTECH CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024093 | METHOD FOR DESIGNING ATOMIC LAYER DEPOSITION PROCESS FOR MANUFACTURING AMORPHOUS OXIDE SEMICONDUCTOR MATERIAL FILM AND AMORPHOUS IGZO MATERIAL FILM MANUFACTURED USING SAME | KR2025/010926 | H01L 21/02 | IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024107 | METHOD FOR BONDING ELECTRONIC COMPONENTS USING PNEUMATIC PRESSURE | KR2025/010965 | H01L 21/48 | AMOGREENTECH CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024221 | SYSTEM AND METHOD FOR IC UNIT SINGULATION AND SORTING | SG2025/050453 | H01L 21/67 | ROKKO SYSTEMS PTE LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024322 | ETCHING SYSTEM FOR FORMING RECESSED FEATURES WITH HIGH ASPECT RATIO | US2025/019496 | H01L 21/768 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024324 | THERMALLY CONDUCTIVE SUBSTRATE BONDING INTERFACE | US2025/021069 | H01L 21/18 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024325 | METAL RECESS DEPTH MEASUREMENTS BY CAPACITOR TEST STRUCTURE | US2025/021435 | H01L 21/66 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024336 | ASSEMBLIES AND METHODS ASSOCIATED WITH AN ELASTICALLY REINFORCED DISPENSABLE GEL | US2025/025716 | H01L 23/373 | PARKER-HANNIFIN CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024355 | IMAGING MASK STACKS AND METHODS FOR LITHOGRAPHICALLY PATTERNING A SUBSTRATE | US2025/030659 | H01L 21/033 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024452 | CONFORMAL SELECTIVE ETCHING OF SILICON OXIDE | US2025/036437 | H01L 21/311 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024463 | PACKAGE COMPRISING AN INTEGRATED DEVICE WITH BACK SIDE METALLIZATION INTERCONNECTS | US2025/037002 | H01L 23/498 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024467 | WAFER TRANSFER ROBOTS INCLUDING END EFFECTORS HAVING INTEGRATED ANTENNAS FOR COMMUNICATION WITH SENSORS | US2025/037075 | H01L 21/677 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024480 | STACKED DIE SEMICONDUCTOR PACKAGE INCLUDING AN ARRAY OF PILLAR STRUCTURES | US2025/037346 | H01L 23/538 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024483 | INTEGRATED DEVICE COMPRISING NON-CIRCULAR PILLAR INTERCONNECTS | US2025/037370 | H01L 23/00 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024485 | PACKAGE COMPRISING SUBSTRATE WITH VIA INTERCONNECTS COMPRISING NON-CIRCULAR PLANAR CROSS SECTION | US2025/037386 | H01L 23/498 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024486 | STACKED DIE SUBSTRATE-LESS SEMICONDUCTOR PACKAGE | US2025/037387 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024523 | SYSTEM AND METHOD FOR PROCESS CHEMISTRY ABATEMENT AND RECYCLING | US2025/037968 | H01L 21/67 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024579 | POLYMER MATERIAL GAP-FILL FOR HYBRID BONDING IN A STACKED SEMICONDUCTOR SYSTEM | US2025/038339 | H01L 23/00 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024658 | SYSTEMS AND METHODS FOR REDUCING TRACE EXPOSURE IN STACKED SEMICONDUCTOR DEVICES | US2025/038548 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024695 | WIRE BONDING SYSTEMS AND RELATED METHODS OF FORMING A VERTICAL WIRE STRUCTURE | US2025/038615 | H01L 23/00 | KULICKE AND SOFFA INDUSTRIES, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024724 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE THAT FACILITATES TSV TESTING | US2025/038666 | H01L 25/065 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024730 | COOLING SYSTEM USING A GASEOUS HEAT TRANSFER MEDIUM | US2025/038682 | H01L 23/467 | DELTA DESIGN, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024742 | DIAMOND COATING FOR SEMICONDUCTOR | US2025/038697 | H01L 23/373 | ADVANCED DIAMOND HOLDINGS, LLC | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024745 | METHODS AND SYSTEMS FOR CONTROLLING HEIGHTS OF DEVICE PACKAGES | US2025/038700 | H01L 25/065 | SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM) | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024831 | MICROFABRICATION OF LOW-RESISTANCE MOLYBDENUM INTERCONNECTS | US2025/038842 | H01L 21/768 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024984 | CONNECTING ELEMENT FOR SEMICONDUCTOR DEVICES | US2025/039141 | H01L 25/065 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/025049 | PACKAGE INTERCONNECT STRUCTURE | US2025/039295 | H01L 23/498 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/025074 | SYSTEMS AND METHODS FOR COOLING ELEMENTS FOR SEMICONDUCTOR AND MULTI-TERMINAL DEVICES | US2025/039333 | H01L 23/373 | AKASH SYSTEMS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای |